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July 21, 2020 - July 31, 2021

SEMI & FlexTech

SEMI FlexTech organizes this series of Flexible Electronics Master Classes on topics proving most challenging to the design, manufacture and use of flexible and printed electronics. The series enables product designers, integrators, and others new to the fields to evaluate technologies and components and make the best choices for their product.

The courses were offered to a live audience July-October, 2020, and are now available on-demand.


United States

SEMI & FlexTech

#1 Flexible Power Sources (1.5 hours)

As new materials and process emerge to enable the integration of high performance micro-electronics into paper-thin, flexible hybrid electronics (FHE), there is an increasing demand for new power sources that also support the goals of ultra-thin and flexible.

Among the key challenges is the ability to achieve high energy densities as the battery thickness decreases to a point where the packaging becomes an increasing fraction of the total volume. The challenge is further complicated by the demanding duty cycles for many FHE systems that require both high power (periodic, large current bursts) and high energy  (operation across many years in some cases).

At the same time, the new power sources must meet the typical high standards for safety, durability, compatibility with a wide range of storage and operation temperatures, and the needs to support effective integration into the FHE platforms.

The session reviews the challenges and progress for new power supplies that are emerging to meet the needs of the FHE community.

Course provided by Brian Berland, Chief Technology Officer, ITN Energy Systems

#2 AI in Thin-Film Manufacturing (2 hours)

This session describes how machine learning and AI-based approaches to research, development, and production brings advantages to clean room processes.  AI-based identification of time-varying equipment performance, and the effects of the previous recipe used on the outcome of the current desired methods, are just some of the ways AI can be used to reduce the process variability.

The team from Cornell University has applied AI approaches to optimize lithography and etching processes involved in the development of an RF wake-up NEMS (Nano Electro Mechnical system) switch that needs a well-controlled gap between a moving shuttle and a contact. The work is applied to plasma etching and the combined prediction of lithography and thin-film etching, using CD-SEM imagery for feature extraction and modeling process variables. Additional approaches to train process-modeling CAD tools to result in better process development experience are developed and explained in this session.

Course instructors includes Amit Lal, Chris Ober, Peter Doerschuk, Banyamin Davaji from Cornell University, and Garry Bordonaro and Jeremy Clark with the Cornell NanoScale Facility.

#3 Hybrid Integration Techniques for Flexible Electronics (1.5 hours)

The 1-hour class describes techniques practiced at PARC for the fabrication of flexible hybrid electronics.  Topics include printing interconnects, logic circuits and resistors, bonding integrated circuits and integrating sensors of different types.  The techniques are illustrated with various examples of wireless sensor prototypes on flexible substrates, and also development of electronics on textiles.

Specific topics covered in this session include:

  • printing interconnects
  • printing fine lines, pads and pad pitches with < 100um
  • logic circuits and resistors
  • bonding integrated circuits
  • integrating sensors of different types on flexible substrates without significant performance degradation
  • pick and place with micron-level accuracy

Course instruction given by Robert Street, Palo Alto Research Center

#4 Flexible Electronics Reliability Testing and Challenges (1.5 hours)

This online Reliability Engineering Master class is for people with an engineering or science background, who want to learn and use methods and techniques to conduct reliability analysis and improvement. This course is intentionally structured to show you a wide variety of reliability engineering knowledge and important applications.

This session outlines the foundation reliability engineering concepts and methods, and how to apply fundamental failure investigation techniques. You will also learn a range of effective workplace improvement solutions and risk analyses used to implement reliability engineering strategies.

Course Instruction given by Dave Rasmussen and Tom Seputis, Molex.

Flexible Hybrid Master Classes for 2021 are offered on many additional topics!  Visit this page for entire list and links to more detailed information on each one.

Featured Speakers

Brian Berland
Brian Berland
Chief Technology Officer, ITN Energy Systems
Amit Lal
Amit Lal
Cornell University
Chris Ober
Chris Ober
Cornell University
Peter Doerschuk
Peter Doerschuk
Cornell University
Benyamin Davaji
Benyamin Davaji
Cornell University
Barry Bordonaro
Garry Bordonaro
Cornell NanoScale Facility
Jeremy Clark
Jeremy Clark
Cornell NanoScale Facility
Bob Street PARC
Robert Street
Palo Alto Research Center
Dave Rasmussen, Molex
Dave Rasmussen
Tom Seputis
tom seputis

Member Price:  $75

Non-Member Price:  $147

Non-Member Price for Government, Military, and Academia Non-Members:  $99

To receive this price, contact Michelle Fabiano at for discount code.  Must have a valid .gov, .mil or .edu email address

Students:  $0 

To receive this price, contact Gity Samadi at for discount code.  Must have a valid student ID card.