Recent Posts
Multi-Sensor Metrology Tools for Hybrid Metrology
SEMI spoke with Thomas Fries, founder and CEO of FRT GmbH, about how hybrid metrology is shaping multi-sensor metrology tools to enhance measurement precision as the industry moves away from a single-sensor approach. Fries offered his views ahead...
Sensor Fusion: Indoor Localization and Augmented GPS Applications
Tracking and localization technologies typically integrate with Wi-Fi and Bluetooth signals to pinpoint the location of people and objects. But what if a venue can’t install beacons or routers, or afford to deploy Wi-Fi or Bluetooth networks?...
Talent and the Battle for Environmental Preservation
In 2016, the then-Secretary-General of the United Nations, Ban-Ki Moon, stated “Saving our planet, lifting people out of poverty, advancing economic growth. These are one and the same fight. We must connect the dots between climate change, water...
Emerging Technologies, Talent and the Future of Work
A key issue surrounding emerging technologies such as artificial intelligence (AI) is their impact on employment and the industry’s workforce. The SEMI Talent Forum, 2-3 May, 2019, in Bristol, UK, will explore new opportunities and challenges of...
Business Futures Shaping the Global Semiconductor Industry
MedTech, autonomous driving and other disruptive technologies will be in focus at the SEMI Industry Strategy Symposium (ISS Europe), 31 March - 2 April 2019 in Milan, Italy, as top European executives, researchers and academics gather to explore...
French Start-Up Moves to the Edge with Battery-Operated Devices
The SEMI Europe Industry Strategy Symposium (ISS Europe) returns in Milan, Italy, this year from 31st March to 2nd April, 2019 to explore new opportunities and challenges in the digital economy. Serena Brischetto of SEMI spoke with GreenWaves...
Fan-Out System-in-Board Technology: Enabling RF and Processor Module and System-Level Integration
SEMI met with Martin Schrems, director of Strategy and Business Development at AT&S AG, to discuss Fan-Out technology trends ahead of SEMI 3D & Systems Summit in Dresden, Germany.
Agile Manufacturing of Glass Carriers for Advanced Packaging
SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on...
Zero Energy Connection (0eC) - A New Way to Transfer Data
SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at...
Future Shines Bright for European Photonics Industry
SEMI met with Dr. Jose Pozo, director of Technology and Innovation at EPIC (European Photonics Industry Consortium), to discuss how 3D packaging applications and heterogeneous integration trends are shaping the European technology landscape. The...
