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Technology and Trends

Standards: Innovation Accelerator for the Electronics Industry

This article is the third in a series highlighting the vital importance of SEMI Standards to commemorate the publication of the 1000th SEMI Standard in July 2019. Find the entire series here.

SEMI Standards are the bedrock of the modern...

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Automotive Driving Traceability

This article is the second in a series highlighting the vital importance of SEMI Standards to commemorate the publication of the 1000th SEMI Standard in July 2019. Find the entire series here.

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1000th SEMI Standard: A Stable Foundation for Energetic Materials

This article is the first in a series highlighting the vital importance of SEMI Standards to commemorate the publication of the 1000th SEMI Standard in July 2019. Find the entire series here.

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Industry Giants TSMC and Intel Vow to Focus on 3D IC Packaging

By Emmy Yi

Post-Conference Report: SEMI Heterogeneous Integration Summit

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Talent and the Battle for Environmental Preservation

In 2016, the then-Secretary-General of the United Nations, Ban-Ki Moon, stated “Saving our planet, lifting people out of poverty, advancing economic growth. These are one and the same fight. We must connect the dots between climate change, water...

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Emerging Technologies, Talent and the Future of Work

A key issue surrounding emerging technologies such as artificial intelligence (AI) is their impact on employment and the industry’s workforce. The SEMI Talent Forum, 2-3 May, 2019, in Bristol, UK, will explore new opportunities and challenges of...

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Blockchain Opportunities in the Semiconductor and Electronics Manufacturing Supply Chain

Semiconductor, electronics and equipment manufacturers today face a number of logistics and supply chain challenges that could be overcome by systems providing a secure, tamper-resistant, single source of truth. Chief among these challenges is...

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Agile Manufacturing of Glass Carriers for Advanced Packaging

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on...

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Zero Energy Connection (0eC) - A New Way to Transfer Data

SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at...

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Advanced Testing Paradigm Shifting in Era of Heterogeneous Integration

By Emmy Yi

New SEMI Taiwan Testing Committee to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.

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